Japan / Korea / Taiwan · Chips & Networking
MLCC & Passive Components
An AI server board uses many times the capacitors of a normal server, and the high-capacitance, high-temperature parts come mainly from Murata and Samsung Electro-Mechanics.
Ceramic powder→MLCC→Board→Server
62
Tightness score ⓘ
#33 of 56
▲ Tightening
Lead time
3–6 mo
Theme 1M
−31.2%% in uptrend
0%Metric to watch
MLCC lead times and prices, and AI share of Murata/SEMCO/Yageo sales.
What would prove us wrong
Weakens if lead times stay flat while AI server builds keep rising.
MLCC theme performance
Equal-weight · rebased 100 · 1YStocks we track
Who controls this bottleneck
Roles, not recommendations. Delayed prices; local currency.
| Stock | Role | Listing | Last | 1D | 1M | 3M | YTD | Off 52w high | Trend | Next earnings |
|---|---|---|---|---|---|---|---|---|---|---|
| 6981.T Murata Manufacturing |
Largest MLCC maker; high-cap parts for AI servers | TSE Japan |
¥5,224.0 | −4.27% | −31.1% | −27.8% | +63.2% | −57.2% | 2026-10-30 | |
| 009150.KS Samsung Electro-Mechanics |
MLCCs and FC-BGA substrates | KRX Korea |
₩886,000 | −4.01% | −35.5% | −30.5% | +247.4% | −61.0% | 2027-01-21 | |
| 6976.T Taiyo Yuden |
MLCCs and inductors | TSE Japan |
¥7,151.0 | −4.35% | −32.5% | −25.9% | +105.2% | −68.3% | 2027-02-05 | |
| 6762.T TDK |
Passive components, MLCCs and power supplies | TSE Japan |
¥2,337.0 | −1.20% | −25.4% | −21.1% | +7.6% | −42.7% | 2026-10-30 | |
| 2327.TW Yageo |
Capacitors and resistors (incl. KEMET) | TWSE Taiwan |
NT$407.0 | −4.12% | −32.0% | −34.0% | +77.5% | −64.3% | 2026-10-29 | |
| 2492.TW Walsin Technology |
MLCCs and passives | TWSE Taiwan |
NT$272.0 | −5.56% | −30.6% | −9.5% | +133.7% | −55.7% | 2026-11-04 |
Recent headlines
Auto-updated- HyperAccel Struggles to Secure Samsung Foundry Capacity, SK hynix MemoryTHE ELEC, Korea Electronics Industry Media · 10h ago
- Samsung Electro-Mechanics’ Early AI Investments Drive Record EarningsTHE ELEC, Korea Electronics Industry Media · 10h ago
- Budget smartphone makers turn to recycled memory as costs surge, Samsung relies on scaleANI News · 12h ago
- ‘Megaproject’ breaks ground at Samsung memory plantThe Korea Herald · 18h ago
- Samsung Electronics breaks ground on new HBM packaging facility in AsanThe Korea Times · 19h ago
- Samsung takes first step in mega-project… 'Asan Onyang' to become HBM packaging hub머니투데이 · 20h ago