Japan / Taiwan · Chips & Networking
Chip Substrates (ABF & Glass)
Large AI packages need big, many-layer ABF substrates. The build-up film itself comes from one supplier; glass-core substrates are the next transition.
ABF film→Core→Build-up layers→Package
64
Tightness score ⓘ
#30 of 56
▲ Tightening
Lead time
12–24 mo
Theme 1M
−31.3%% in uptrend
0%Metric to watch
Ibiden/Unimicron capacity adds, ABF film supply commentary, and glass-core qualification news.
What would prove us wrong
Weakens if substrate makers report utilisation falling while AI package sizes keep growing.
Dependencies
Substrates theme performance
Equal-weight · rebased 100 · 1YStocks we track
Who controls this bottleneck
Roles, not recommendations. Delayed prices; local currency.
| Stock | Role | Listing | Last | 1D | 1M | 3M | YTD | Off 52w high | Trend | Next earnings |
|---|---|---|---|---|---|---|---|---|---|---|
| 4062.T Ibiden |
High-end ABF substrates for AI accelerators | TSE Japan |
¥6,344.0 | −8.32% | −40.3% | −33.5% | +89.0% | −51.9% | 2026-10-29 | |
| 3037.TW Unimicron |
ABF substrate capacity | TWSE Taiwan |
NT$792.0 | −8.33% | −32.9% | −20.2% | +260.7% | −40.2% | 2026-10-27 | |
| 8046.TW Nan Ya PCB |
ABF substrates | TWSE Taiwan |
NT$972.0 | −10.00% | −32.5% | −15.5% | +304.2% | −35.4% | — | |
| 2802.T Ajinomoto |
Sole major supplier of ABF build-up film | TSE Japan |
¥4,260.0 | −0.09% | −19.5% | −17.6% | +29.8% | −30.6% | 2027-02-04 |